RCA Cleaning Process
Step 1: Submerse wafers in three baths; cascade rinse in DI after each step
| Bath | Solution | Temp. | Time |
|---|
| 1 | 4:1:1 DI:NH4OH:H2O2 | 75C | 5 minutes |
| 2 | 50:1 DI:HF | 20C | 30 seconds |
| 3 | 4:1:1 DI:HCl:H2O2 | 75C | 5 minutes |
Step 2: Spray dry with nitrogen gas
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November 13, 1995