Photolithography

Step 1: Deposit photoresist film on wafers
  1. Center wafer on Headway Research Model LS 510 Spinner
  2. Drip on 1/2 pipette of Shipley Microposit S-1813 Photoresist
  3. Spin for 5 sec at 700 rpm
  4. Spin for 60 sec at 4000 rpm
  5. Bake at 120C for 3 min on Thermodyne Type 1900 Hot Plate
Step 2: Expose wafers to Photomask
  1. Place wafer on Karl Suss MJB 3 UV400 Mask Aligner
  2. Align wafer to mask using alignment marks
  3. Bring wafer into final contact with mask
  4. Expose wafer for 6-7 sec to 15 mW/cm^2 UV light
Step 3: Develop the wafers
  1. Center wafer on Headway Research Model LS 510 Spinner
  2. Puddle completely with Shipley MF319 Developer Solution
  3. Develop (let stand) for 60 seconds
  4. Spin at 700 RPM for 60 seconds to rinse
  5. Spin at 4000 RPM for 60 seconds to dry
  6. Bake at 120C for 3 min on Thermodyne Type 1900 Hot Plate
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November 13, 1995